microelectronic packaging

Lids

We are the world’s leading supplier of hermetic lids to meet your microelectronic packaging requirements. Our product line encompasses a full range of lids that can be customized to meet your specific application whether for the semiconductor, MEMS, medical or optical market.

Materion Delivers

  • Operations in North America, Singapore and the Philippines
  • Can support most configurations, applications and volume requirements
  • Specializing in precious metal alloys to complement your solder applications
  • Extensive tool library offers standard size preforms and cover lids

Making advanced materials that improve the world.

Click for more information about Materion Preforms and Ceramic Packages.

View our lid application comparison chart.

  • Combo-Lids™ – for high-reliability applications
  • Micro-Lids™ – for packages smaller than .300 in2
  • Seam Seal-Lids™ – for sealing heat sensitive electronics
  • Solder Reflow-Lids™ – a cost alternative to Combo-LidTM
  • Visi-Lids™ – for optical packages
  • Non-Magnetic Lids – for specialty applications
  • Ceramic Combo Lids™ – for specialty applications
  • Epo-Lids™ – Epoxy-coated ceramic for commercial applications
Microelectronic Packaging

Microelectronic Packages

For all your secure packaging needs. Our microelectronics packaging product line includes: ceramic packages, hermetic lids, AuSn preforms & frames, lead-free solder alloys and braze alloys.

Combo-lids

Combo-Lids

When you need cover lids for high-reliability applications in semiconductor, MEMS, crystal oscillator, medical and optical devices, our unique patented Combo-Lids™ and Ceramic Combo-LidsTM can function in the harshest service environments.

preforms

Preforms

We produce solder preforms in the broadest range of materials, shapes and dimensions for multiple microelectronics applications.

Solder alloys

Braze & Solder

We produce braze and solder alloys for microelectronic packaging and high temperature joining. All of our solder alloys and gold brazing alloys are available in a variety of customized shapes and forms.

braze alloys

Sheet, Strip & Wire

We manufacture superior silver sheet, sterling strip material and silver brazing alloys that are the #1 choice worldwide. Our sterling silver wire and fine silver wire offer unparalleled surface quality, whatever your application.

BondFlow™ Adhesive

Our revolutionary new die attach adhesive enables low cost, high volume die attach onto a variety of surfaces. It can be applied onto the backside of a wafer and is especially well-suited for photonic devices.