microelectronic packaging


We are the world’s leading supplier of hermetic lids to meet your microelectronic packaging requirements. Our product line encompasses a full range of lids that can be customized to meet your specific application whether for the semiconductor, MEMS, medical or optical market.

Materion Delivers

  • Operations in North America, Singapore and the Philippines
  • Can support most configurations, applications and volume requirements
  • Specializing in precious metal alloys to complement your solder applications
  • Extensive tool library offers standard size preforms and cover lids

Making advanced materials that improve the world.

Click for more information about Materion Preforms and Ceramic Packages.

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  • Combo-Lids™ – for high-reliability applications
  • Micro-Lids™ – for packages smaller than .300 in2
  • Seam Seal-Lids™ – for sealing heat sensitive electronics
  • Solder Reflow-Lids™ – a cost alternative to Combo-LidTM
  • Visi-Lids™ – for optical packages
  • Non-Magnetic Lids – for specialty applications
  • Ceramic Combo Lids™ – for specialty applications
  • Epo-Lids™ – Epoxy-coated ceramic for commercial applications
Microelectronic Packaging

Microelectronic Packages

For all your secure packaging needs. Our microelectronics packaging product line includes: ceramic packages, hermetic lids, AuSn preforms & frames, lead-free solder alloys and braze alloys.



When you need cover lids for high-reliability applications in semiconductor, MEMS, crystal oscillator, medical and optical devices, our unique patented Combo-Lids™ and Ceramic Combo-LidsTM can function in the harshest service environments.



We produce solder preforms in the broadest range of materials, shapes and dimensions for multiple microelectronics applications.

Solder alloys

Braze & Solder

We produce braze and solder alloys for microelectronic packaging and high temperature joining. All of our solder alloys and gold brazing alloys are available in a variety of customized shapes and forms.

braze alloys

Sheet, Strip & Wire

We manufacture superior silver sheet, sterling strip material and silver brazing alloys that are the #1 choice worldwide. Our sterling silver wire and fine silver wire offer unparalleled surface quality, whatever your application.

BondFlow™ Adhesive

Our revolutionary new die attach adhesive enables low cost, high volume die attach onto a variety of surfaces. It can be applied onto the backside of a wafer and is especially well-suited for photonic devices.