braze alloys

Silver Sheet, Strip & Wire

We manufacture superior silver sheet, sterling or silver strip or wire and silver braze alloys that are the #1 choice worldwide.
Our sterling silver wire and fine silver wire offer unparalleled surface quality, whatever your application.

Enabling Technology

Our leading-edge technologies enable the development of precious metal sheet, strip and wire with multiple beneficial properties.

  • Wide coils of fine silver sheet are slit into smaller coils to meet your exacting requirements
  • Multiple slitters are operated simultaneously, enabling us to be the fastest and most reliable supplier of pure silver strip for stamping
  • Leading-edge manufacturing equipment produces superior finish precious metal wire in coils or spools
  • Our silver metallurgists will partner with you to design custom precious metal configurations

Making advanced materials that improve the world.

Click for more information about Materion Silver Sheet and Wire or Solder Alloys.

  • Silver sheet and strip available in myriad sizes, including widths from .100” to 6” wide.
  • Commonly ordered thicknesses: .006” through .162” in Brown & Sharpe gauge increments
  • Manufactured with tailorable surface finish
  • Silver Braze alloys in various widths and thickness
  • Wire produced in a wide array of sterling silver, 999 fine silver, platinum alloys, BAg alloys (silver brazing alloys) and other precious metal alloys

 

 

microelectronic packaging

Lids

We are the world’s leading supplier of hermetic lids to meet your microelectronic packaging requirements. Our product line encompasses a full range of lids that can be customized to meet your specific application whether for the semiconductor, MEMS, medical or optical market.

Combo-lids

Combo-Lids

When you need cover lids for high-reliability applications in semiconductor, MEMS, crystal oscillator, medical and optical devices, our unique patented Combo-Lids™ and Ceramic Combo-LidsTM can function in the harshest service environments.

preforms

Preforms

We produce solder preforms in the broadest range of materials, shapes and dimensions for multiple microelectronics applications.

Microelectronic Packaging

Microelectronic Packages

For all your secure packaging needs. Our microelectronics packaging product line includes: ceramic packages, hermetic lids, AuSn preforms & frames, lead-free solder alloys and braze alloys.

Solder alloys

Braze & Solder

We produce braze and solder alloys for microelectronic packaging and high temperature joining. All of our solder alloys and gold brazing alloys are available in a variety of customized shapes and forms.

BondFlow™ Adhesive

Our revolutionary new die attach adhesive enables low cost, high volume die attach onto a variety of surfaces. It can be applied onto the backside of a wafer and is especially well-suited for photonic devices.