BondFlow™ is a revolutionary, new die attach adhesive. It can be applied onto the backside of a wafer and B-staged prior to wafer singulation. This backside die attach adhesive will cure in only 2 seconds under 50 – 100 psi pressure at 250°C.
The benefits of BondFlow™: Our unique adhesive can be spin-coated or printed onto a wide variety of surfaces. It adheres well to bare ceramics, silicate (window) glass, CVD diamond and Al, Au, Ni, Si and GaAs.
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For all your secure packaging needs. Our microelectronics packaging product line includes: ceramic packages, hermetic lids, AuSn preforms & frames, lead-free solder alloys and braze alloys.
We are the world’s leading supplier of hermetic lids to meet your microelectronic packaging requirements. Our product line encompasses a full range of lids that can be customized to meet your specific application whether for the semiconductor, MEMS, medical or optical market.
When you need cover lids for high-reliability applications in semiconductor, MEMS, crystal oscillator, medical and optical devices, our unique patented Combo-Lids™ and Ceramic Combo-LidsTM can function in the harshest service environments.
We produce solder preforms in the broadest range of materials, shapes and dimensions for multiple microelectronics applications.
We produce braze and solder alloys for microelectronic packaging and high temperature joining. All of our solder alloys and gold brazing alloys are available in a variety of customized shapes and forms.
We manufacture superior silver sheet, sterling strip material and silver brazing alloys that are the #1 choice worldwide. Our sterling silver wire and fine silver wire offer unparalleled surface quality, whatever your application.
