When you need cover lids for high-reliability applications in semiconductor, MEMS, crystal oscillator, medical and optical devices,
our unique patented Combo-Lids™ and Ceramic Combo-LidsTM can function in the harshest service environments.

Materion Delivers


The base metal of our high performance Combo-Lids™ is Kovar™ or Alloy 42, which is plated with nickel and gold flash, and tack-welded to a solder perform, usually AuSn eutectic. The nickel layer inhibits corrosion, while the precious metal (gold) layer promotes solderability and ensures a clean particulate-free surface. Tack-welding the solder preform to the lid conveniently aligns the solder to the perimeter of the lid, simplifying handling and reducing part count.

Ceramic Combo-LidsTMCeramic Combo Lid

Our one-stop station tack-welds Gold-Tin, Lead and Lead-free solder preforms onto metalized ceramic lids. Our metallization capability creates an effective seal ring that allows excellent soldering. Gold-Tin alloys provide superior hermetic sealing and edge melting provides fillet formation. Other non-precious and lead-free soldering is available as well as tack-welding service for soldering preforms onto ceramic lids.

Making advanced materials that improve the world.


  • Length & width dimension tolerance +/-.003″
  • Thickness dimension tolerance is +/-.001″
  • Flatness
    • <.001″ for lids <.500″
    • .002 for lids >.500″
  • Burrs <.001″

Lid Frame

  • Length & width dimension tolerance +/-.003”
  • Thickness dimension tolerance +/-.0003”

Lid Material

  • Ceramic (Alumina) in various ranges of Al2O3

Lid Color

  • Brown, White and Ivory

Lid Shapes

  • Square, Rectangle and Flat

Lid Seal Ring

  • Generally nickel layer followed by gold layer
  • Available with or without metallization
Microelectronic Packaging

Microelectronic Packages

For all your secure packaging needs. Our microelectronics packaging product line includes: ceramic packages, hermetic lids, AuSn preforms & frames, lead-free solder alloys and braze alloys.

microelectronic packaging


We are the world’s leading supplier of hermetic lids to meet your microelectronic packaging requirements. Our product line encompasses a full range of lids that can be customized to meet your specific application whether for the semiconductor, MEMS, medical or optical market.



We produce solder preforms in the broadest range of materials, shapes and dimensions for multiple microelectronics applications.

Solder alloys

Braze & Solder

We produce braze and solder alloys for microelectronic packaging and high temperature joining. All of our solder alloys and gold brazing alloys are available in a variety of customized shapes and forms.

braze alloys

Sheet, Strip & Wire

We manufacture superior silver sheet, sterling strip material and silver brazing alloys that are the #1 choice worldwide. Our sterling silver wire and fine silver wire offer unparalleled surface quality, whatever your application.

BondFlow™ Adhesive

Our revolutionary new die attach adhesive enables low cost, high volume die attach onto a variety of surfaces. It can be applied onto the backside of a wafer and is especially well-suited for photonic devices.