Microelectronic Packages
For all your secure packaging needs, our extensive microelectronics packaging product line includes: ceramic packages, hermetic lids, AuSn preforms & frames, lead-free solder alloys, braze alloys and more.
Materion Delivers
- Our high-performance electronic packaging materials are manufactured in a wide variety of standard designs and shapes and can be customized to meet your specifications.
- Variety of alloys offering superior thermal and electrical conductivity.
- Operations in North America, Singapore and Philippines.
- Highly reliable hermetic lids provide superior sealing and protection for delicate electronics.
- Dedicated design team to assist with New Product Development.
Making advanced materials that improve the world.
Available Products
We’ve got you covered – hermetic and non-hermetic lids for semiconductor, MEMS, medical or optical requirements:
- Combo-LidsTM – pre-assembled solder preform and lid
- Micro-LidsTM – for packages smaller than .300 in2
- Seam-Seal LidsTM – for sealing heat sensitive electronics
- Solder Reflow LidsTM – cost alternative to Combo-LidsTM
- Visi-LidsTM – for optical packages
- Epo-LidsTM – epoxy-coated ceramic for non-hermetic uses
- Ceramic Combo-LidsTM – for specialty applications
Materials for microelectronic packaging and high temperature joining:
- AuSn Preforms
- Braze Materials
- Solder Alloys
- Lead Free Solders
Customized shapes and forms, including ribbon, wire, preforms and powder.
RF & microwave packages for low thermal resistance and RF loss. Complementary packages and lids.
Lids
We are the world’s leading supplier of hermetic lids to meet your microelectronic packaging requirements. Our product line encompasses a full range of lids that can be customized to meet your specific application whether for the semiconductor, MEMS, medical or optical market.
Combo-Lids
When you need cover lids for high-reliability applications in semiconductor, MEMS, crystal oscillator, medical and optical devices, our unique patented Combo-Lids™ and Ceramic Combo-LidsTM can function in the harshest service environments.
Preforms
We produce solder preforms in the broadest range of materials, shapes and dimensions for multiple microelectronics applications.
Braze & Solder
We produce braze and solder alloys for microelectronic packaging and high temperature joining. All of our solder alloys and gold brazing alloys are available in a variety of customized shapes and forms.
Sheet, Strip & Wire
We manufacture superior silver sheet, sterling strip material and silver brazing alloys that are the #1 choice worldwide. Our sterling silver wire and fine silver wire offer unparalleled surface quality, whatever your application.
BondFlow™ Adhesive
Our revolutionary new die attach adhesive enables low cost, high volume die attach onto a variety of surfaces. It can be applied onto the backside of a wafer and is especially well-suited for photonic devices.