Microelectronic Packages
For all your secure packaging needs, our extensive microelectronics packaging product line includes: ceramic packages, hermetic lids, AuSn preforms & frames, lead-free solder alloys, braze alloys and more.
For all your secure packaging needs, our extensive microelectronics packaging product line includes: ceramic packages, hermetic lids, AuSn preforms & frames, lead-free solder alloys, braze alloys and more.
We’ve got you covered – hermetic and non-hermetic lids for semiconductor, MEMS, medical or optical requirements:
Materials for microelectronic packaging and high temperature joining:
Customized shapes and forms, including ribbon, wire, preforms and powder.
RF & microwave packages for low thermal resistance and RF loss. Complementary packages and lids.
Our revolutionary new die attach adhesive enables low cost, high volume die attach onto a variety of surfaces. It can be applied onto the backside of a wafer and is especially well-suited for photonic devices.